Core Specifications
| Material | Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead) |
| Diameter Range | 0.2mm to 0.76mm (Standard) | Custom Sizes Available |
| Tolerance | <5μm Precision (±0.005mm) |
| Melting Point | Standard 183°C | Custom Melting Points Optional |
| Packaging | 250,000 pcs/Bottle, Vacuum-Sealed Anti-Oxidation |
Key Advantages
Superior Solderability:
Ensures minimal voiding and bright, reliable joints for high-density PCB assembly.
Thermal Stability:
Eutectic composition prevents phase separation, reducing cold joints risk.
Customization:
Tailor diameter/melting point for specialized applications (e.g., low-temperature Bi58 alloys).
Applications
BGA/Chip Packaging:
Ideal for flip-chip, CSP, and micro-BGA underfills.
Precision Electronics:
Micro-connections in sensors, medical devices, and aerospace modules.
Electroplating Anodes:
Uniform spheres for consistent plating thickness.
Quality & Compliance
- Standards: Conforms to IPC & RoHS exemptions for critical electronics.
- Testing: 100% optical inspection, shear strength ≥45MPa.
Hot Tags: sn63pb37 0.2mm, China sn63pb37 0.2mm manufacturers, suppliers, factory, Sn63Pb37 0 25mm, Sn63Pb37 0 2mm, Standard SAC 0 5mm, Standard SAC 0 35mm, High Ag SAC, Standard SAC 0 76mm