About
our company
We are a specialized manufacturer of high-performance metal and alloy materials for the semiconductor industry. Established in 2024 in Shenzhen, China, our mission is to bring cutting-edge technology and precision manufacturing to global markets.
Our operational footprint spans key locations in China. We have established offices in Luoyang (Henan), Hengqin (Zhuhai), and Longgang (Shenzhen). This strategic presence allows us to serve a diverse and prestigious clientele, which includes aerospace enterprises and listed companies from both domestic and international markets.
WHY
CHOOSE US
Specialized manufacturer of high-performance metal and alloy materials dedicated to the semiconductor industry, with deep insights into advanced electronics and chip packaging demands.
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Strict Quality & Compliance SystemCertified with ISO9000, ISO14000, IATF16949, and supported by ROHS, REACH and SGS test reports, meeting international quality and environmental standards.
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Comprehensive Value-Added ServicesProvides professional post-sales technical support and solder ball/solder column placement services, focusing on full-process customer satisfaction.
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Broad Market & High-End ClienteleProducts serve global markets and are widely applied in consumer electronics, automotive electronics, aerospace & defense, industrial automation and robotics. Serves renowned domestic and international aerospace enterprises and listed companies.
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Innovation & Customer OrientationCommitted to technological innovation, precision manufacturing and high-quality delivery, with strong capability to meet stringent requirements of modern high-end applications.
PRODUCTS CATEGORIES
High-Precision & Customizable Products
Custom sizing with 3-day turnaround
Post-sales technical support
Solder ball/solder column placement services for clients
Our hot sale products
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![Sn63Pb37 0.2mm]( "Sn63Pb37 0.2mm")
Sn63Pb37 0.2mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.25mm]( "Sn63Pb37 0.25mm")
Sn63Pb37 0.25mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.3mm]( "Sn63Pb37 0.3mm")
Sn63Pb37 0.3mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.35mm]( "Sn63Pb37 0.35mm")
Sn63Pb37 0.35mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.4mm]( "Sn63Pb37 0.4mm")
Sn63Pb37 0.4mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.45mm]( "Sn63Pb37 0.45mm")
Sn63Pb37 0.45mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.5mm]( "Sn63Pb37 0.5mm")
Sn63Pb37 0.5mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm... -
![Sn63Pb37 0.55mm]( "Sn63Pb37 0.55mm")
Sn63Pb37 0.55mmMaterial: Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead)
Diameter Range: 0.2mm to 0.76mm (Standard) | Custom Sizes Available
Tolerance: <5μm...
Latest news and events
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![Manufacturing Process Of Miniature Helical Spring Welding Posts]()
Feb 20, 2026Manufacturing Process Of Miniature Helical Spring Welding PostsThe core of the manufacturing process of miniature helical spring welding posts lies in the coordinated control of precision forming and low heat input welding.view more -
![The Function Of Miniature Helical Spring Welding Column]()
Feb 19, 2026The Function Of Miniature Helical Spring Welding ColumnThe main role of miniature helical spring welding studs is in stud welding.view more -
![Advantages Of CCGA Bonds]()
Feb 18, 2026Advantages Of CCGA BondsCCGA (Ceramic Pillar Grid Array) bonds are an improved structure of CBGA (Ceramic Ball Grid Array), using solder pillars instead of traditional solder balls.view more
