Core Specifications
|
Material |
Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead) |
|
Diameter Range |
0.2mm to 0.76mm (Standard) | Custom Sizes Available |
|
Tolerance |
<5μm Precision (±0.005mm) |
|
Melting Point |
Standard 183°C | Custom Melting Points Optional |
|
Packaging |
250,000 pcs/Bottle, Vacuum-Sealed Anti-Oxidation |
Key Advantages
Superior Solderability
Ensures minimal voiding and bright, reliable joints for high-density PCB assembly.
Thermal Stability
Eutectic composition prevents phase separation, reducing cold joints risk.
Customization
Tailor diameter/melting point for specialized applications (e.g., low-temperature Bi58 alloys).
Applications
BGA/Chip Packaging
Ideal for flip-chip, CSP, and micro-BGA underfills.
Precision Electronics
Micro-connections in sensors, medical devices, and aerospace modules.
Electroplating Anodes
Uniform spheres for consistent plating thickness.
Quality & Compliance
- Standards: Conforms to IPC & RoHS exemptions for critical electronics.
- Testing: 100% optical inspection, shear strength ≥45MPa.
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