Micro-Coil Spring: Precision Interconnect for Demanding Applications
Engineered for high-reliability connections where flexibility and durability are paramount. These precision springs provide superior stress relief and electrical continuity in the most challenging environments.
What Are Micro-Coil Springs?
Micro-Coil Springs, also known as spring-loaded interconnect pins or spring solder columns, are advanced mechanical components designed to create reliable electrical connections between two surfaces. Unlike rigid solder joints, these tiny springs compress and expand, absorbing mechanical stress, thermal expansion mismatches, and vibration. They are the ideal solution for applications requiring both electrical conductivity and mechanical compliance.
Standard Specifications & Customization
Our standard Micro-Coil Springs are manufactured with precision to ensure consistent performance. We offer a range of standard sizes and coatings, with full customization available to meet your exact project requirements.
Standard Sizes (Diameter × Length)
|
Diameter (mm) |
Length (mm) |
Typical Application |
|
0.51 |
1.27 |
High-density BGA, CSP |
|
0.40 |
1.00 |
Ultra-fine pitch, MEMS |
Note: Both diameter and length are fully customizable to your specific design needs.
Standard Coating Options
SN60PB40 Coating
A classic eutectic solder alloy (60% Tin, 40% Lead) applied at a standard thickness of 2.5 microns. Provides excellent wettability and forms a reliable solder joint with most common pastes. Ideal for applications not requiring lead-free compliance.
Ni/Au (Electroless Nickel Immersion Gold)
A robust, lead-free finish. The structure consists of:
Gold (Au) Layer: 0.25 microns – Provides superior oxidation resistance, ensuring long-term shelf life and reliable solderability.
Nickel (Ni) Barrier: 0.76–1.5 microns – Acts as a diffusion barrier, preventing the formation of brittle copper-tin intermetallics and ensuring joint integrity.
Coating thickness and alloy composition can be tailored to match your specific soldering profile, substrate material, and reliability targets.
Core Advantages & Applications
Superior Stress Relief
The spring mechanism absorbs forces from thermal cycling, vibration, and mechanical shock, drastically reducing stress on solder joints and preventing fatigue failure.
Compensation for Tolerances
Accommodates uneven surfaces, coplanarity issues, and Z-axis height variations between components and PCBs, ensuring a consistent connection.
High Reliability in Harsh Environments
Excellent performance under extreme temperatures and mechanical stress makes them perfect for automotive, aerospace, and downhole electronics.
Enhanced Electrical Performance
Maintains stable, low-resistance contact throughout its compression cycle, critical for high-frequency and power applications.
Ideal For Your Most Demanding Projects
Micro-Coil Springs are the interconnect of choice when standard BGA balls or rigid columns fall short. They are extensively used in:
- Aerospace & Defense: Avionics, radar systems, and satellite communications where reliability is non-negotiable.
- Automotive Electronics: Engine control units (ECUs), sensors, and ADAS systems exposed to constant vibration and thermal cycles.
- High-Performance Computing: Servers and processors requiring robust connections for large, thermally cycling packages.
- Medical Devices: Implantable and diagnostic equipment where failure is not an option.
- Test & Burn-In Sockets: Providing a reliable, yet removable, connection for device testing.
- Elevate your design's reliability. Contact us today to discuss how our customizable Micro-Coil Spring solutions can be integrated into your next-generation electronics.
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