Product Overview
Sn42Bi58 solder balls are a lead-free, eutectic alloy composed of 42% Tin (Sn) and 58% Bismuth (Bi). This specific composition results in a precisely low melting point of 138°C, making it an ideal solution for applications where component or substrate heat sensitivity is a primary concern. They are widely used in Ball Grid Array (BGA) and Chip Scale Package (CSP) technologies to create reliable electrical and mechanical interconnections.
Key Features & Benefits
Ultra-Low Melting Point
With a eutectic melting point of 138°C, it significantly reduces thermal stress during reflow, protecting heat-sensitive LEDs, flexible PCBs, and other delicate components from damage.
RoHS Compliant & Eco-Friendly
As a lead-free alloy, it meets stringent global environmental regulations like RoHS, ensuring your products are safe for both people and the planet.
Excellent Solderability
Offers excellent wetting properties, resulting in full, shiny solder joints with minimal solder balling or bridging. This makes it suitable for fine-pitch printing applications down to 0.3mm.
Reliable Mechanical Performance
Provides sufficient joint strength for many applications, with a typical tensile strength around 55 MPa and shear strength of approximately 27.8 kPa.
Technical Specifications
|
Parameter |
Specification |
|
Alloy Composition |
Sn 42%, Bi 58% |
|
Melting Point |
138°C ± 2°C |
|
Density |
~8.6 g/cm³ |
|
Particle Size (for paste) |
Type 3 (25-45 μm) / Type 4 (20-38 μm) available |
|
Recommended Reflow Peak |
150°C - 160°C |
Ideal Applications
Sn42Bi58 solder balls are the preferred choice for assemblies that cannot withstand high-temperature processes:
LED Assembly
Protecting sensitive LED chips and flexible circuits during soldering.
Consumer Electronics
Mobile phone camera modules, wearable devices, and other compact PCBs.
Temperature-Sensitive Components
MEMS sensors, certain plastic connectors, and heat-sensitive substrates.
Step-Soldering Processes
Where a subsequent soldering step must occur at a lower temperature than the first.
Considerations & Best Practices
While excellent for low-temperature applications, it's important to note that Sn-Bi alloys like Sn42Bi58 can be more brittle than higher-temperature SAC alloys. They are best suited for applications without significant mechanical shock or thermal cycling stress. For optimal results, ensure proper storage (recommended 5-10°C for solder paste) and use within its shelf life to maintain printing performance.
Why Choose Our Sn42Bi58 Solder Balls?
We supply high-purity, spherical Sn42Bi58 solder balls with consistent alloy composition and diameter control, ensuring reliable ball attach and excellent co-planarity for your BGA and CSP packages. Our products support optimized assembly processes for high-yield manufacturing.
Ready to Integrate Low-Temperature Soldering?
Elevate your assembly process for heat-sensitive designs. Contact us today for technical datasheets, samples, and expert support to implement Sn42Bi58 in your next project.
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