Technical Specifications
|
Alloy Composition |
Sn96.5 / Ag3.0 / Cu0.5 (Lead-Free / RoHS Compliant) |
|
Melting Point |
217°C - 219°C |
|
Density |
7.4 g/cm³ |
|
Standard Diameters |
Available from 0.05 mm to 2.0 mm |
|
Customization |
We offer precise custom diameter scaling (e.g., 0.55 mm) to fit your specific substrate design and pitch requirements. |
Core Advantages & Quality Assurance
We understand that in semiconductor manufacturing, even a micron-level deviation can impact yield. KINSTREAM ensures industry-leading consistency through:
Perfect Sphericity & Dimensional Accuracy
Advanced atomization technology ensures highly spherical balls with ultra-tight diameter tolerances, facilitating seamless automated placement.
Superior Oxidation Control
Low oxide content on the surface ensures excellent wetting and reduces the risk of "voiding" during the reflow process, enhancing solderability.
Strict Lot-to-Lot Consistency
Every batch undergoes rigorous micro-structure inspection and chemical analysis to ensure uniform alloy distribution and mechanical strength.
Optimized Micro-structure
Our controlled manufacturing environment yields a refined grain structure, significantly improving the long-term reliability of solder joints under thermal stress.
Primary Application Scenarios
KINSTREAM SAC305 solder balls are the preferred choice for high-density electronic packaging:
BGA & CSP Rework
Providing stable electrical connections for high-pin-count components.
Semiconductor Packaging
Enabling next-gen miniaturization for mobile, automotive, and industrial electronics.
Wafer-Level Packaging (WLP)
Supporting fine-pitch bumping for advanced chip-scale solutions.
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