Plain Solder Columns

Details

Standard Diameters: 0.30mm, 0.38mm, 0.51mm.
Available Lengths: Customizable from 1.27mm to 3.8mm.
Ideal Applications: Standard CCGA packaging, telecommunications infrastructure, and industrial computing.
Non-Reflowable Stability: High melting point prevents collapse during board-level assembly.
Optimized Stand-off: Provides excellent stress relief for large-die ceramic packages.
High Purity: Minimal trace elements to ensure long-term metallurgical stability.

Precision Engineered High-Lead Interconnects

Our Plain Solder Columns represent the industry standard for Ceramic Column Grid Array (CCGA) packaging. Manufactured using high-purity, high-melting-point alloys such as Pb90Sn10 and Pb85Sn15, these columns are specifically designed to remain solid during secondary reflow processes. This ensures a consistent and controlled stand-off height, critical for managing Coefficient of Thermal Expansion (CTE) mismatches between the ceramic substrate and the PCB.

Key Features

Non-Reflowable Stability	High melting point prevents collapse during board-level assembly.
Optimized Stand-off	Provides excellent stress relief for large-die ceramic packages.
High Purity	Minimal trace elements to ensure long-term metallurgical stability.

Specifications

Standard Diameters	0.30mm, 0.38mm, 0.51mm.
Available Lengths	Customizable from 1.27mm to 3.8mm.
Ideal Applications	Standard CCGA packaging, telecommunications infrastructure, and industrial computing.