The Chinese 3D-packaged copper core sphere market reached approximately RMB 950 million in 2023 and is projected to exceed RMB 1.7 billion by 2030, with a global CAGR of 8.2%.
Currently, the market demand for copper core spheres (CCSB) is continuously rising with the popularization of advanced packaging technologies. Its core driving force comes from the explosive growth of high-performance computing, AI chips, and high-bandwidth memory (HBM). The following is a key analysis of market demand:
HBM Memory Stacking: In AI training and data center scenarios, HBM achieves TB/s-level bandwidth through multi-layer DRAM vertical stacking, placing extremely high demands on the thermal stability and reliability of solder joints. Copper core spheres, due to their non-collapse characteristic during multiple reflows, have become the preferred interconnect solution for HBM packaging.
AI Chips and High-End GPUs: AI accelerators such as the NVIDIA H100 employ Chiplet architecture and 3D packaging, relying on copper core spheres to achieve high-density, high-reliability connections between logic chips and HBM to address the challenges of hundreds of watts of power consumption and high current density.
Automotive electronics and industrial control: In high-reliability fields such as automotive electronics, copper core balls have better shock resistance than traditional solder balls and are suitable for harsh working environments.
