When using solder balls, pay attention to the amount used, storage conditions, shock and moisture protection, and size matching to avoid oxidation and solder bridging.
Standardized Use and Operation: When using solder balls, only take out the necessary amount at a time to avoid taking out too much at once, which can lead to oxidation upon exposure to air. Used solder balls should be stored separately in dedicated containers, and their reliability must be verified before reuse. Do not shake or violently agitate the solder balls during operation to prevent quality degradation.
Proper Matching of Process Parameters: The diameter of the solder ball should be precisely matched to the pad size. It is recommended that the solder ball diameter be 60%-80% of the pad size (e.g., 0.15mm pad is suitable for 0.10-0.12mm solder balls) to avoid solder bridging due to excessive size or cold solder joints due to insufficient size. At the same time, the amount of flux and solder paste used during ball placement should not be too much or too little to prevent soldering defects.
Strictly Control the Storage Environment: Solder balls should be stored in an environment with a temperature of 25±10℃ and a relative humidity below 60%RH. The shelf life is generally 12 months. More stringent storage recommendations are 18~28℃ and 10%~65% humidity, and away from strong oxidizing gases. Unused solder balls should be kept in their original containers, with both inner and outer caps tightly closed to prevent air ingress and oxidation.
Prevent External Factors: The storage environment should avoid vibration, moisture, and direct sunlight, as these factors may degrade the solder ball's performance. Ideally, the temperature and humidity of the usage environment should be consistent with the storage conditions to minimize the impact of sudden environmental changes.
