Globally, environmental requirements for electronic products are increasingly stringent, and many countries and regions have introduced regulations restricting or banning the use of lead-based solder. For example, the EU's RoHS Directive explicitly stipulates limits on hazardous substances such as lead in electronic products. The implementation of these regulations has driven the widespread application of lead-free solder balls in the electronics manufacturing industry.
YS/T 1222-2025 Solder Balls and Granules (Non-ferrous Metals Industry Standard)
Publication and Implementation Date: Released on August 19, 2025; Effective March 1, 2026
Responsible Unit: National Technical Committee on Standardization of Non-ferrous Metals (SAC/TC 243)
This standard specifies product classification, technical requirements, test methods, inspection rules, packaging, transportation, and accompanying documents;
It integrates and replaces the original YS/T 1222-2018 and YS/T 1221-2018;
It strictly controls impurity content (such as Pb, As, Cu, etc.) to improve product purity and quality.
