Copper core balls play a crucial role in 3D packaging, maintaining structural stability, improving electrothermal performance, and ensuring high-reliability interconnects. Especially in HBM memory and AI chips, they are a core supporting technology for achieving high-density stacking and high-performance computing.
With the extreme pursuit of computing power and data transfer rates in AI chips and high-bandwidth memory (HBM), traditional solder balls face bottlenecks such as collapse and electromigration under multiple reflow soldering processes and high current loads. Copper core balls (CCSB), with their unique structure, maintain package space stability and support multi-layer stacking. In 3D packaging, chips undergo multiple reflow soldering processes. Traditional solder balls completely melt at 250°C and are prone to collapse under the pressure of upper-layer components, leading to short circuits. However, the copper core of the copper core ball has a melting point as high as 1083°C, remaining solid during soldering, effectively supporting package gaps, preventing deformation and bridging, and ensuring the structural integrity of HBM multi-layer DRAM stacks.
Improving electrothermal performance to meet the high power consumption requirements of AI chips.
With conductivity 5–10 times that of solder balls, it significantly reduces current density, suppresses electromigration, extends solder joint life, and ensures the stability of AI training chips under long-term high load operation.
Superior thermal conductivity helps to quickly dissipate heat from HBM and GPU cores, alleviating "hot spot" issues and improving overall system reliability.
