A Copper Core Solder Ball (CCSB) is a high-performance composite solder ball used in 3D packaging technology. It has a copper core, with nickel and tin plating on the outer layers, providing high electrical and thermal conductivity, and excellent resistance to deformation.
The Copper Core Solder Ball (CCSB) is an upgraded alternative to traditional BGA solder balls, designed specifically to meet the needs of high-density, multi-layered advanced electronic packaging. Its structure consists of three parts:
Copper Core: Typically 0.03–0.5 mm in diameter, with a melting point as high as 1083°C, far exceeding the reflow soldering temperature (approximately 250°C), ensuring it does not melt or deform during multiple thermal cycles, maintaining package space stability.
Nickel Plating: Approximately 2–3 μm thick, used to suppress diffusion between copper and the substrate metal, improving soldering reliability.
Solder Plating: Composed of pure tin, lead-free alloys such as SAC305, etc., responsible for the actual solder connection.
